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Abstract: Electroless nickel electroless palladium immersion gold (ENPIG) is widely used for the surface finish of integrated circuit (IC) package substrate. The Ni-P coating has magnetic effects and ...
Abstract: This paper presents the results of a thermal fatigue study of a 2512 ceramic chip resistor assembled with various Pb free solders including SnCu, SAC105, SAC205, SAC305, and SAC405. The test ...
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