Nominate your scientific computing stars for the inaugural SCW75 – an annual recognition programme celebrating the individuals driving innovation at the intersection of computing and scientific ...
Abstract: As the integrated chip packaging technology progresses from 2.5-D to 3-D, new issues arise regarding the reliability of interconnects. The analysis of interconnect reliability is inherently ...
Engineers and industry leaders at the COMSOL Conference to explore innovation, learn new modeling skills, and build ...
The MarketWatch News Department was not involved in the creation of this content. BURLINGTON, Mass., March 11, 2026 (GLOBE NEWSWIRE) -- COMSOL, an independently-owned global leader in modeling and ...
Abstract: This paper reports a simulation study of ZnO/Si-based photodetection structure in COMSOL Multiphysics. The optical performance of the resultant device has been explored under a broad light ...
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