The chiplets design combines IP access, interposer expertise, and relationships with HBM suppliers, foundries and OSATs ...

Multi-die design teams should adopt modular principles, utilize proven IP blocks with D2D support, and implement automated ...

FlexNoC interconnect IP with resilience option and advanced memory data traffic management enables Renesas to create power-efficient, low-latency, high-performance systems-on-chips (SoCs) with ...

Since I can’t cover everything, here are some recommended articles from other websites. ° From 9to5Mac: Apple has raised the ...

Intel and Versa have announced a new partnership to run real time AI workloads and secure networking at the Intelligent Edge ...

Intel, with its Core Ultra 200S processors, popularly known as the "Arrow Lake" family, ambitiously adopted a chiplet-style ...

Based CPU-GPU Architecture with Replay-Driven Simulation and Emulation,” was published by researchers at Intel, Nvidia and ...

SoIC leverages copper-to-copper hybrid bonding to vertically stack multiple dies, enabling shorter interconnects and lower ...

Technology continues to advance even in the face fo supply chain issues due to war and tariffs. This year we asked our contributors to focus on a single topic area to get more in-depth insights into ...

Cadence’s leadership in agentic AI is expanded by integrating portfolio of chip and system design solutions with NVIDIA’s accelerated computing stack ...

Is INTC a good stock to buy? We came across a bearish thesis on Intel Corporation on Irrational Analysis’s Substack. In this ...

Apple's chip designs for the M5 Pro and M5 Max have adjacent dies, using the same UltraFusion architecture that enabled the ...