"Achieving phase-pure superconducting films requires careful attention to the substrate-film interface," said Shahrjerdi. "Our findings show that substrate design is an integral aspect of the ...

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...

Intel has revealed more details today about its "breakthrough" glass substrate technology - a new way to manufacture processors that promises numerous benefits to todays standard organic substrate ...

NIMS discovered a phenomenon in which droplets on a single solid surface exhibit both a "sticky" and "repellent" state simultaneously. Namely, the wetting behavior branches into two states. This is a ...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...

Subscribe to our newsletter for the latest sci-tech news updates. The study, published in Applied Physics Letters by NYU Tandon School of Engineering and Brookhaven National Laboratory, shows how ...