Many companies employ some kind of inspection to verify process steps within their surface-mount technology (SMT) lines. Because solder-paste volume is an important predictor of solder-joint quality ...

X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...

In recent years, the area array components like BGA, QFN, CSP, and flip chips, are aplicate wider and wider in the electronics manufacturing. Such as BGA, comparing with other components, it has ...