The EP21FL two-part epoxy-resin system features low to moderate viscosity and is suitable for potting, coating, and sealing electronic assemblies. It is said to excel at bonding dissimilar substrates ...
Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilised for under fill, coating, impregnating, and porosity sealing ...
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