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The world’s largest chip-assembly house just said its advanced packaging sales will double this year — the quiet bottleneck choking AI hardware

Every cutting-edge AI accelerator, whether it carries an NVIDIA, AMD, or custom hyperscaler logo, must pass through a step most people never think about: advanced packaging, the intricate process of ...
Semiconductor Engineering

Optimizing End-to-End Communication And Workload Partitioning In MCM Accelerators (Georgia Tech)

A new technical paper titled “MCMComm: Hardware-Software Co-Optimization for End-to-End Communication in Multi-Chip-Modules” was published by researchers at Georgia Tech. “Increasing AI computing ...
Seeking Alpha

NXP Semiconductors rolls out higher output multi-chip modules to boost its 5G infrastructure share

Dec. 02, 2020 9:35 AM ETNXP Semiconductors N.V. (NXPI) Stock NXPIBy: SA News Team ...
MacRumors

MacBook Pro Models With M5 Chips Might Not Launch Until Next Year

In a research note today, Apple supply chain analyst Ming-Chi Kuo suggested that MacBook Pro models with M5 chips might not launch until 2026. Kuo discussed how the A20 chips in iPhone 18 models will ...
EDN

5G chips and modules address power efficiency and size

5G chipmakers have placed a lot of attention on supporting new 5G technologies, including 5G-Advanced, satellite non-terrestrial network (NTN) connectivity, 5G fixed wireless access (FWA), and 5G Open ...