Layout for ICs at process geometries of 90 nm and below becomes a very dicey affair. Even at 180 nm, the number of design rules that must be enforced for an ASIC or system-on-a-chip to be ...
Advances in integrated circuit technology and fabrication have made it possible to leverage traditional CMOS fabrication processes and materials and apply them to the design of Photonic Integrated ...
SANTA CRUZ, Calif. — Claiming the first automated design for manufacturability (DFM) capability “designed for designers,” Silicon Canvas announced a new set of DFM features for its Laker custom IC ...
SANTA CLARA, CA-- May 25, 2016 - Silicon Creations, a supplier of high-performance semi-custom analog and mixed-signal intellectual property (IP), and Silvaco, Inc., a leading supplier of Electronic ...
3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
A technique used on older process nodes is providing even more valuable benefits as IC designers work on devices that will be manufactured at advanced technology nodes including 28 nm and beyond. Now ...
The strengths of Taiwan's IC design sector include excellent and dedicated STEM talent, a complete semiconductor industry ecosystem from upstream to downstream, and a well-developed downstream ICT ...
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