Huntsman Advanced Materials (Basel, Switzerland) reports that it has developed a new epoxy resin system and a novel and cost-efficient compression molding concept. By combining a new fast-cure ...

When engineers at General Dynamics Armament and Technical Products (GDATP) recently designed the ammunition container for a new aircraft weapon system, they decided very early in the process to make ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

AZoM talks to DeWayne Howell and Jason Gabriel (Technical Engineering TenCate/CCS Composites), about the process of compression molding for composites and what the benefits and applications of this ...

Chopped prepreg molding compound (CPMC), a relatively new material form resembling molding compounds made from chopped resin impregnated tow, provides design and processing engineers various benefits ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

CLINTON, Tenn.--(BUSINESS WIRE)--When a major aerospace OEM needed a thermally conductive, autoclavable resin to advance the performance of 3D-printed composite molds for compression molding, it ...

Here, Klaus Ritter, Head of the Centre of Excellence for Composites at Huntsman Advanced Materials, looks at how the company is helping to optimise the latest out-of-autoclave manufacturing techniques ...

In the automotive industry, especially in lightweight construction for hybrids and electric vehicles, there is growing demand for components that are not just light, but also exhibit high stiffness ...

New York, Aug. 08, 2020 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Closed Molding Composites Market Research Report by Fiber Type, by Manufacturing Process, by ...