Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--Helic, Inc. announced today that its electromagnetic (EM) modeling engine and RaptorX™ have been certified for GLOBALFOUNDRIES 22nm FD-SOI (22FDX®) process ...

The annual IEEE International Symposium on EMC, sponsored by the EMC Society often includes workshops on the basics of numerical modeling, plus technical sessions on the latest modeling developments.

A broad association of researchers from across Lawrence Berkeley National Laboratory (Berkeley Lab) and the University of California, Berkeley have collaborated to perform an unprecedented simulation ...

To achieve gains in power, performance, area, and cost, 3D-IC architectures are pushing electronics design to new limits. Silicon integration technology and associated devices have undergone an ...