A next-generation board-test system combines structural, parametric, high-speed interconnect, and functional testing to address the growing complexity of AI and data-centre hardware manufacturing.

Researchers at MIT have developed a new technology that could help robots manipulate the tiniest of tiny components, and they call it an electroadhesive stamp. Share on Facebook (opens in a new window ...

Kirigami enhances the Japanese art form of origami, which involves folding paper to create 3D designs, by strategically incorporating cuts to the paper prior to folding. The method enables artists to ...

The company, based in Ness Ziona, Israel, has established a novel new side-mounting technology for printed circuit boards using additive manufacturing. The circuit boards they created have increased ...

Engineers have invented a new type of biodegradable circuit board that could drastically reduce electronic waste. The environmentally-friendly design, developed by a team at the University of Glasgow, ...