Why security is important to the chiplet supply chain. Synopsys' 3DIC Compiler platform, enhanced by AI optimizations, handles multi-die and advanced chiplet packaging co-design and optimization for 2 ...

The chiplets movement is gaining steam, and it’s apparent from how this multi-die silicon premise is dominating the program of the AI Hardware and Edge AI Summit to be held in San Jose, California ...

VisualSim Architect shows how system-level modeling can expose latency, power, and thermal tradeoffs early in chiplet-based ...

Introduces support for the latest interconnect standards, including Universal Chiplet Interconnect Express™ (UCIe™) 2.0 and Open Compute Project Bunch of Wires (BoW). Enhances Keysight’s EDA standards ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--Baya Systems, a leader in software-driven, chiplet-ready fabric IP for scalable AI and high-performance computing, today announced two key milestones: successful ...

Alchip Technologies, Inc., the AI infrastructure and high-performance ASIC leader, today revealed significant development in its commercialization of 2nm customer devices. The company announced that ...

Chiplet PHY Designer 2025 from Keysight offers simulation capabilities for UCIe 2.0 and support for the Open Compute Project Bunch of Wires (BoW) standard. Tailored to AI and data center applications, ...

In the rapidly evolving landscape of automotive electronics, traditional monolithic design approaches are giving way to something more flexible and powerful—chiplets. These modular microchips, which ...

Chiplets have emerged as a critical implementation paradigm for semiconductor products, primarily because they can deliver cost benefits relative to a non-chiplet-based approach. The first, most ...

Forward-looking: Chipmakers are getting serious about splitting up complex chip designs across multiple smaller "chiplets." AMD is leading the charge, having already implemented multi-chiplet ...

Apple M5 Pro and M5 Max chips could debut at Apple’s upcoming event on March 4th and power the new MacBook Pro models. Both chips could offer more CPU and GPU cores, courtesy of a new chiplet design.

An interesting AMD patent has just surfaced, and although it was filed a while back, finding it now is all the more exciting because this tech might be closer to appearing in future graphics cards.