SINGAPORE, July 9, 2025 /PRNewswire/ -- As digital transformation sweeps across the global packaging sector, Pacdora has emerged as a key force driving change. As a leading online 3D packaging design ...

Pacdora Canvas brings AI concept generation, 3D mockups, and production-ready dieline export onto one infinite canvas - ...

Intel has unveiled a new packaging innovation for creating 3D chip packages and multiple chip connections ahead of the Semicon West conference in San Francisco this week. The company is detailing its ...

The PSMA (Power Sources Manufacturers Association) Packaging Committee announced that it has published a report titled "Current Developments in 3D Packaging With Focus on Embedded Substrate ...

With semiconductor packaging becoming a more crucial piece of the Moore’s Law roadmap, the industry is still sorting out the impact of a 3D design and packaging approach on design time, cost and power ...

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

(MENAFN- PR Newswire) Since its launch in March 2022, Pacdora has quickly gained traction, completing a nearly $10 million Series A funding round and reaching a valuation of over $100 million.