The chiplets design combines IP access, interposer expertise, and relationships with HBM suppliers, foundries and OSATs ...
Forbes contributors publish independent expert analyses and insights. Samsung had an industry Foundry event focused on solutions for “Empowering the AI Revolution,” where they announced new process ...
SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: KEYS) today introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The ...
What design considerations are there for 3D IC packaging? How do issues like thermal design differ with 3D IC packages? 3D IC ...
SANTA ROSA, Calif. - Keysight Technologies, Inc. (NYSE:KEYS) introduced a new Electronic Design Automation (EDA) tool called 3D Interconnect Designer aimed at addressing design challenges in chiplet ...
Optimization of the Inter-Chiplet Interconnect And The Chiplet Placement (ETH Zurich, U. of Bologna)
A new technical paper titled “PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies” was published by researchers at ETH Zurich and University of Bologna. “2.5D integration technology is ...
A new technical paper titled “Advanced Chiplet Placement and Routing Optimization considering Signal Integrity” was published by researchers at KAIST. “This article addresses the critical challenges ...
Samsung Electronics is reportedly considering applying 3D chiplet technology to its Exynos mobile application processors (APs). A company official familiar with the matter said that Samsung is ...
3D Interconnect Designer simplifies high-speed 3D interconnect design for silicon bridges and interposers. As chiplet architectures are increasingly adopted, engineers face complex 3D interconnect ...
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